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LA-74-08-1 -- Specification and...
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IEC 60748-21 Ed. 2.0 b:1997Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval proceduresstandard by International Electrotechnical Commission, 04/10/1997
IEC 61189-3 Ed. 1.0 b:1997 [ Withdrawn ]Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)standard by International Electrotechnical Commission, 04/10/1997
IEC 61189-2 Ed. 1.0 b:1997 [ Withdrawn ]Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structuresstandard by International Electrotechnical Commission, 04/10/1997
IEC 61619 Ed. 1.0 b:1997Insulating liquids - Contamination by polychlorinated biphenyls (PCBs) - Method of determination by capillary column gas chromatographystandard by International Electrotechnical Commission, 04/10/1997
IEC 60079-5 Ed. 2.0 b:1997 [ Withdrawn ]Electrical apparatus for explosive gas atmospheres - Part 5: Powder filling "q"standard by International Electrotechnical Commission, 04/10/1997
IEC 60748-22-1 Ed. 2.0 b:1997Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval proceduresstandard by International Electrotechnical Commission, 04/10/1997
IEC 60748-22 Ed. 2.0 b:1997Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval proceduresstandard by International Electrotechnical Commission, 04/10/1997
IEC 60748-21-1 Ed. 2.0 b:1997Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lproceduresstandard by International Electrotechnical Commission, 04/10/1997
IEC 61189-1 Ed. 1.0 b:1997Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodologystandard by International Electrotechnical Commission, 03/27/1997
IEC 61773 Ed. 1.0 b CORR1:1997Corrigendum 1 - Overhead lines - Testing of foundations for structuresCorrigenda by International Electrotechnical Commission, 03/27/1997
IEC 60317-34 Ed. 2.0 b:1997 [ Withdrawn ]Specifications for particular types of winding wires - Part 34: Polyester enamelled round copper wire, class 130Lstandard by International Electrotechnical Commission, 03/27/1997
IEC 60317-44 Ed. 1.0 b:1997Specifications for particular types of winding wires - Part 44: Aromatic polyimide tape wrapped rectangular copper wire, class 240standard by International Electrotechnical Commission, 03/27/1997