No products

BS PD CEN ISO/TR 20659‑2:2024 Rheological test methods. Fundamentals...

BS PD ISO/IEC TS 18013‑7:2024 Historical[ Withdrawn ] Personal...

BS PD ISO/TS 20790:2024 Oil and gas industries including lower carbon...

BS PD CEN ISO/TR 8124‑8:2024 Safety of toys - Age determination. First...

BS PD ISO/IEC TS 8236-2:2025 Information technology. Provisioning,...

BS PD CEN/TR 14380:2024 Lighting applications. Tunnel lighting standard...


BS PD CEN/TR 16389:2025 Automotive fuels. Paraffinic diesel fuel and...
Viewed products
ASTM D6927-22...
IEC 62044-2 Ed. 1.0 b:2005...
IEC 60317-0-1 Ed. 2.2 b:2005 [ Withdrawn ]Specifications for particular types of winding wires - Part 0-1: General requirements - Enamelled round copper wire CONSOLIDATED EDITIONstandard by International Electrotechnical Commission, 11/21/2005
IEC 60317-30 Amd.2 Ed. 1.0 b:2005 [ Withdrawn ]Amendment 2 - Specifications for particular types of winding wires - Part 30: Polyimide enamelled rectangular copper wire, class 220Amendment by International Electrotechnical Commission, 11/21/2005
IEC 60282-1 Ed. 6.0 b:2005 [ Withdrawn ]High-voltage fuses - Part 1: Current-limiting fusesstandard by International Electrotechnical Commission, 11/21/2005
IEC 61241-0 Ed. 1.0 b CORR1:2005Corrigendum 1 - Electrical apparatus for use in the presence of combustible dust - Part 0: General requirementsCorrigenda by International Electrotechnical Commission, 11/21/2005
IEC 62329-1 Ed. 1.0 b:2005Heat shrinkable moulded shapes - Part 1: Definitions and general requirementsstandard by International Electrotechnical Commission, 11/21/2005
IEC 60371-3-5 Ed. 2.0 b:2005Insulating materials based on mica - Part 3: Specifications for individual materials - Sheet 5: Glass-backed mica paper with an epoxy resin binder for post-impregnation (VPI)standard by International Electrotechnical Commission, 11/21/2005
IEC 60749-34 Ed. 1.0 b:2005Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cyclingstandard by International Electrotechnical Commission, 11/21/2005
IEC 60749-24 Ed. 1.0 b:2005Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HASTstandard by International Electrotechnical Commission, 11/21/2005
IEC 60749-33 Ed. 1.0 b:2005Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclavestandard by International Electrotechnical Commission, 11/21/2005
IEC 62329-1 Ed. 1.0 en:2005Heat shrinkable moulded shapes - Part 1: Definitions and general requirementsstandard by International Electrotechnical Commission, 11/21/2005
IEC 60684-3-214 Ed. 2.0 en:2005 [ Withdrawn ]Flexible insulating sleeving - Part 3: Specifications for individual types of sleeving - Sheet 214: Heat-shrinkable, polyolefin sleeving, not flame retarded, shrink ratio 3:1 - Thick and medium wallstandard by International Electrotechnical...
IEC 60684-3-212 Ed. 2.0 en:2005Flexible insulating sleeving - Part 3: Specifications for individual types of sleeving - Sheet 212: Heat-shrinkable polyolefin sleevingsstandard by International Electrotechnical Commission, 11/21/2005