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BS PD IEC TR 61760-3-1:2022
M00000032
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BS PD IEC TR 61760-3-1:2022 Surface mounting technology-Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
standard by BSI Group, 10/31/2022
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All current amendments available at time of purchase are included with the purchase of this document.