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IEC 61189-2-807 Ed. 1.0 b:2021
M00000750
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IEC 61189-2-807 Ed. 1.0 b:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
standard by International Electrotechnical Commission, 09/01/2021
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This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td)
of base laminate materials using thermogravimetric analysis (TGA).