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BS PD IEC TR 63378-1:2021
M00000434
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BS PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages
standard by BSI Group, 01/11/2022
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Full Description
This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.
All current amendments available at time of purchase are included with the purchase of this document.