Full Description

This paper reviews the PCB and test fixture design criteria, along with key assembly process parameters that affect test probe contact. Through a series of designed experiments, the significance of these factors are investigated. In conclusion, a set of design and process recommendations are presented that provide optimum test probe contact for solder paste vias with a no-clean process.

Product Details

Published: 11/01/2000 Number of Pages: 9 File Size: 1 file , 700 KB