Full Description

Organic flux residues deposited onto the surfaces of flip-chip assemblies during reflow soldering operations have been shown, in some cases, to affect the properties of underfill materials. The results of a series of experiments designed to evaluate the effects of post-reflux cleaning processes on the performance of flip-chip assemblies are reported.

Product Details

Published: 11/01/2000 Number of Pages: 12 File Size: 1 file , 1.4 MB