Full Description

ESD SP5.0-2018 applies to ESD withstand level information in datasheets or other information publications such as reliability or qualification reports. All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, optoelectronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) should have this information provided.

Product Details

Published: 2018 ANSI: ANSI Approved Number of Pages: 12 File Size: 1 file , 280 KB