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IEC 61760-3 Ed. 2.0 b:2021
IEC 61760-3 Ed. 2.0 b:2021Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) solderingstandard by International Electrotechnical Commission, 02/03/2021
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IEC 62906-5-3 Ed. 1.0 en:2021
IEC 62906-5-3 Ed. 1.0 en:2021Laser displays - Part 5-3: Measuring methods of image quality for laser projection displaysstandard by International Electrotechnical Commission, 02/03/2021
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IEC 62372 Ed. 2.0 en:2021
IEC 62372 Ed. 2.0 en:2021Nuclear instrumentation - Housed scintillators - Measurement methods of light output and intrinsic resolutionstandard by International Electrotechnical Commission, 02/03/2021
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IEC 61189-5-601 Ed. 1.0 b:2021
IEC 61189-5-601 Ed. 1.0 b:2021Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards...
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IEC 61189-5-502 Ed. 1.0 b:2021
IEC 61189-5-502 Ed. 1.0 b:2021Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assembliesstandard by International Electrotechnical...
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IEC 60958-5 Ed. 1.0 b:2021
IEC 60958-5 Ed. 1.0 b:2021Digital audio interface - Part 5: Consumer application enhancementstandard by International Electrotechnical Commission, 02/03/2021
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IEC 61869-13 Ed. 1.0 b:2021
IEC 61869-13 Ed. 1.0 b:2021Instrument transformers - Part 13: Stand-alone merging unit (SAMU)standard by International Electrotechnical Commission, 02/03/2021
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IEC 62787 Ed. 1.0 b:2021
IEC 62787 Ed. 1.0 b:2021Concentrator photovoltaic (CPV) solar cells and cell on carrier (CoC) assemblies - Qualificationstandard by International Electrotechnical Commission, 02/03/2021
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IEC 61188-6-2 Ed. 1.0 b:2021
IEC 61188-6-2 Ed. 1.0 b:2021Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)standard by International Electrotechnical Commission, 02/04/2021
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IEC 62769-150-1 Ed. 1.0 b:2021
IEC 62769-150-1 Ed. 1.0 b:2021Field device integration (FDI) - Part 150-1: Profiles - ISA100 WIRELESSstandard by International Electrotechnical Commission, 02/04/2021
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IEC 62769-7 Ed. 2.0 b:2021
IEC 62769-7 Ed. 2.0 b:2021Field Device Integration (FDI) - Part 7: FDI Communication Devicesstandard by International Electrotechnical Commission, 02/05/2021
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IEC 62769-1 Ed. 2.0 b:2021
IEC 62769-1 Ed. 2.0 b:2021Field device integration (FDI) - Part 1: Overviewstandard by International Electrotechnical Commission, 02/05/2021
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