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JEDEC JEP156A

M00001620

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JEDEC JEP156A CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION

standard by JEDEC Solid State Technology Association, 03/01/2018

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This publication references a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products.

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Published: 03/01/2018 Number of Pages: 24File Size: 1 file , 85 KB