Cart 0 Product Products (empty)
No products
To be determined Shipping
$0.00 Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart. There is 1 item in your cart.
Total products
Total shipping To be determined
Total
New Reduced price! 
View larger
View larger 
IEC 62453-302 Ed. 1.0 en:2009
M00000076
New product
IEC 62453-302 Ed. 1.0 en:2009 Field device tool (FDT) interface specification - Part 302: Communication profile integration - IEC 61784 CPF 2
standard by International Electrotechnical Commission, 06/30/2009
In stock
More info
Full Description
IEC 62453-302:2009(E) provides information for integrating the CIP technology into the FDT interface specification (IEC 62453-2). It specifies communication and other services. This specification neither contains the FDT specification nor modifies it. Communication Profile Family 2 (commonly known as CIPTM1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, IEC 61158-6-2, and IEC 62026-3. The basic profiles CP 2/1 (ControlNetTM2), CP 2/2 (EtherNet/IPTM3), and CP 2/3 (DeviceNetTM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNetTM1), also based on CIPTM, is defined in [14].This publication is to be read in conjunction with IEC 62453-2:2009.