Cart 0 Product Products (empty)
No products
To be determined Shipping
$0.00 Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart. There is 1 item in your cart.
Total products
Total shipping To be determined
Total
New Reduced price! 
View larger
View larger 
IEC 60191-6-18 Ed. 1.0 b CORR2:2010
M00000677
New product
IEC 60191-6-18 Ed. 1.0 b CORR2:2010 Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Corrigenda by International Electrotechnical Commission, 07/28/2010
In stock