Cart 0 Product Products (empty)
No products
To be determined Shipping
$0.00 Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart. There is 1 item in your cart.
Total products
Total shipping To be determined
Total
New Reduced price! 
View larger
View larger 
IEC 61191-1 Ed. 2.0 b:2013
M00000081
New product
IEC 61191-1 Ed. 2.0 b:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
standard by International Electrotechnical Commission, 05/21/2013
In stock
More info
Full Description
IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:- reference standard IEC 61192-1 has been replaced by IPC-A-610;
- some of the terminology has been updated;
- references to IEC standards have been corrected;
- the use of lead-free alloys in the assembly have been added.