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New Reduced price! IEC 61189-3-719 Ed. 1.0 b:2016 View larger

IEC 61189-3-719 Ed. 1.0 b:2016

M00003457

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IEC 61189-3-719 Ed. 1.0 b:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

standard by International Electrotechnical Commission, 01/05/2016

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IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.