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IEC 60068-2-58 Amd.1 Ed. 4.0 en:2017
M00002795
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IEC 60068-2-58 Amd.1 Ed. 4.0 en:2017 Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Amendment by International Electrotechnical Commission, 07/28/2017
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