Cart 0 Product Products (empty)
No products
To be determined Shipping
$0.00 Total
Product successfully added to your shopping cart
Quantity
Total
There are 0 items in your cart. There is 1 item in your cart.
Total products
Total shipping To be determined
Total
New Reduced price! 
View larger
View larger 
IEC 62137-3 Ed. 1.0 b:2011
M00000795
New product
IEC 62137-3 Ed. 1.0 b:2011 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
standard by International Electrotechnical Commission, 11/08/2011
In stock
More info
Full Description
IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.