Could I help you?
> >IEC 60068-2-58 Ed. 3.0 b:2005
New Reduced price! IEC 60068-2-58 Ed. 3.0 b:2005 View larger

IEC 60068-2-58 Ed. 3.0 b:2005

M00002146

New product

IEC 60068-2-58 Ed. 3.0 b:2005 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

standard by International Electrotechnical Commission, 02/23/2005

More details

In stock

$55.04

-57%

$128.00

More info

Full Description

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.

Product Details

Edition: 3.0 Published: 02/23/2005 Number of Pages: 53 File Size: 1 file , 1.3 MB