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BS 3934-5:1997
Mechanical standardization of semiconductor devices - Recommendations applying to tape automated bonding (TAB) of integrated circuitsMore info
Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
| Author | BSI |
|---|---|
| Editor | BSI |
| Document type | Standard |
| Format | File |
| EAN ISBN | 0 580 27812 3 |
| ICS | 31.080.01 : Semiconductor devices in general |
| Number of pages | 38 |
| Replace | BS 3934-5:1992 |
| Cross references | IEC 60191-5:1997 |
| Year | 1990 |
| Country | United Kingdom |
| Keyword | BS 3934:Part 5:1997 |