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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures - Copper-clad laminates for flexible boards (adhesive and non-adhesive types)More info
| Author | BSI |
|---|---|
| Editor | BSI |
| Document type | Standard |
| Format | File |
| EAN ISBN | 978 0 580 59472 4 |
| ICS | 31.180 : Printed circuits and boards |
| Number of pages | 32 |
| Cross references | IEC/PAS 61249-3-1:2007 |
| Year | 2007 |
| Country | United Kingdom |
| Keyword | DD IEC/PAS 61249-3-1 ; DDIEC/PAS61249-3-1 ; DD IEC/PAS 6124931 ; DD IEC/PAS 61249:3:1 ; DD IECPAS 61249-3-1 ; DDIEC/PAS 61249 3-1 ; DD IEC/PAS61249 3-1 ; DD IEC/PAS 612493-1 |