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IEC 62739-1 (2013-06)
IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processingMore info
IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
| Author | International Electrotechnical Commission (IEC) |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 1.0 |
| ICS | 31.190 : Electronic component assemblies 31.240 : Mechanical structures for electronic equipment |
| Number of pages | 36 |
| Replace | IEC 91/1092/FDIS (2013-03) |
| Cross references | DIN EN 62739-1 (2014-02), IDT |
| Year | 2013 |
| Document history | IEC 62739-1 (2013-06) |
| Country | Switzerland |
| Keyword | IEC62739;IEC 62739-1:2013 |