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IEC 62047-18 (2013-07)
IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materialsMore info
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
| Author | International Electrotechnical Commission (IEC) |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 1.0 |
| ICS | 31.080.99 : Other semiconductor devices |
| Number of pages | 26 |
| Replace | IEC 47F/155/FDIS (2013-04) |
| Cross references | DIN EN 62047-18 (2014-04), IDT |
| Year | 2013 |
| Document history | IEC 62047-18 (2013-07) |
| Country | Switzerland |
| Keyword | IEC62047;IEC 62047-18:2013 |