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IEC 60191-4 (2013-10)
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packagesMore info
IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code 'S' is added to indicate a silicon based package.
b) Description of 'WL' is added to be used for general use.
| Author | International Electrotechnical Commission (IEC) |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 3.0 |
| ICS | 31.080.01 : Semiconductor devices in general |
| Number of pages | 48 |
| Replace | IEC 60191-4 AMD 1 (2001-11) IEC 60191-4 (1999-10) IEC 60191-4 AMD 2 (2002-07) IEC 60191-4 Edition 2.2 (2002-10) |
| Cross references | DIN EN 60191-4 (2014-10), IDT |
| Year | 2013 |
| Document history | IEC 60191-4 (2013-10) IEC 47D/837/FDIS (2013-07) IEC 47D/803/CDV (2011-06) IEC 47D/769/CD (2010-04) IEC 60191-4 Edition 2.2 (2002-10) IEC 60191-4 AMD 2 (2002-07) |
| Country | Switzerland |
| Keyword | IEC60191;IEC 60191-4:2013 |