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IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as 'LSI-Package-Board' (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.
Author | IEC |
---|---|
Editor | CEI |
Document type | Standard |
Format | File |
Edition | 1.0 |
ICS | 31.180 : Printed circuits and boards 31.200 : Integrated circuits. Microelectronics 35.060 : Languages used in information technology |
Number of pages | 194 |
Year | 2016 |
Country | International |
Keyword | IEC63055;IEC 63055:2016 |