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IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.
Author | IEC |
---|---|
Editor | CEI |
Document type | Standard |
Format | File |
Edition | 1.0 |
ICS | 31.180 : Printed circuits and boards 87.080 : Inks. Printing inks |
Number of pages | 15 |
Year | 2018 |
Country | International |
Keyword | IEC62899;IEC 62899-202-5:2018 |