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IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.
| Author | IEC |
|---|---|
| Editor | CEI |
| Document type | Standard |
| Format | File |
| Edition | 1.0 |
| ICS | 31.180 : Printed circuits and boards 87.080 : Inks. Printing inks |
| Number of pages | 15 |
| Year | 2018 |
| Country | International |
| Keyword | IEC62899;IEC 62899-202-5:2018 |