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ASME BPVC-2025 SET Complete Set without Binders Includes all 33 volumes...







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IEC 62640 Amd.1 Ed. 1.0 b:2015...
IEC 60851-2 Ed. 3.1 b:2015Winding wires - Test methods - Part 2: Determination of dimensions CONSOLIDATED EDITIONstandard by International Electrotechnical Commission, 05/21/2015
IEC 62878-1-1 Ed. 1.0 b:2015Device embedded substrate - Part 1-1: Generic specification - Test methodsstandard by International Electrotechnical Commission, 05/20/2015
IEC 62769-5 Ed. 1.0 b:2015Field Device Integration (FDI) - Part 5: FDI Information Modelstandard by International Electrotechnical Commission, 05/20/2015
IEC 62769-3 Ed. 1.0 b:2015Field Device Integration (FDI) - Part 3: FDI Serverstandard by International Electrotechnical Commission, 05/20/2015
IEC 62056-4-7 Ed. 1.0 b:2015Electricity metering data exchange - The DLMS/COSEM suite - Part 4-7: DLMS/COSEM transport layer for IP networksstandard by International Electrotechnical Commission, 05/20/2015
IEC 61760-4 Ed. 1.0 b:2015Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devicesstandard by International Electrotechnical Commission, 05/19/2015
IEC 62769-101-1 Ed. 1.0 b:2015 [ Withdrawn ]Field device Integration (FDI) - Part 101-1: Profiles - Foundation Fieldbus H1standard by International Electrotechnical Commission, 05/19/2015
IEC 61788-21 Ed. 1.0 b:2015Superconductivity - Part 21: Superconducting wires - Test methods for practical superconducting wires - General characteristics and guidancestandard by International Electrotechnical Commission, 05/19/2015
IEC 62769-101-2 Ed. 1.0 b:2015 [ Withdrawn ]Field Device Integration (FDI) - Part 101-2: Profiles - Foundation Fieldbus HSEstandard by International Electrotechnical Commission, 05/19/2015
IEC 60172 Ed. 4.0 b:2015 [ Withdrawn ]Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wiresstandard by International Electrotechnical Commission, 05/12/2015
IEC 62769-7 Ed. 1.0 b:2015Field Device Integration (FDI) - Part 7: FDI Communication Devicesstandard by International Electrotechnical Commission, 05/12/2015
IEC 62769-6 Ed. 1.0 b:2015Field Device Integration (FDI) - Part 6: FDI Technology Mappingstandard by International Electrotechnical Commission, 05/12/2015